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XC7S50-1FTGB196I - AMD

Description: FPGA - Field Programmable Gate Array XC7S50-1FTGB196I

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XC7S50-1FTGB196I - AMD PCB footprint - BGA - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S50-1FTGB196I - AMD  - 3D model - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S50-1FTGB196I Details

  • Manufacturer Part Number:

    XC7S50-1FTGB196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e3

  • Length:

    15 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S50-1FTGB196I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S50-1FTGB196I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • You can implement a reliable POR by using an external POR circuit or by using the internal POR circuitry. The internal POR circuitry is enabled by default, but it can be disabled by programming the FPGA. It's recommended to use an external POR circuit for more reliable operation.
  • The recommended clocking scheme for XC7S50-1FTGB196I is to use a single clock domain for the entire design. However, if multiple clock domains are required, it's recommended to use a clock domain crossing (CDC) circuit to ensure reliable data transfer between domains.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling can be used to reduce power consumption.
  • The maximum current draw for XC7S50-1FTGB196I is approximately 1.5A for the 1V core voltage and 0.5A for the 3.3V auxiliary voltage. However, the actual current draw will depend on the specific design and operating conditions.

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XC7S50-1FTGB196I Overview

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Image Part Number Model
Part Image XC7S50-1FTGB196C AMD

Field Programmable Gate Array, 4075 CLBs, 1098MHz, 52160-Cell, PBGA196

Part Image XC7S50-1FTGB196Q AMD

Field Programmable Gate Array, 4075 CLBs, 1098MHz, 52160-Cell, PBGA196

Part Image XC7S50-1FTGB196Q AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1098MHz, 52160-Cell, PBGA196

Part Image XC7S50-1FTGB196I AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1098MHz, 52160-Cell, PBGA196