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XC7S50-2CSGA324I - AMD

Description: FPGA

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XC7S50-2CSGA324I - AMD PCB footprint - BGA - BGA - CSG324
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XC7S50-2CSGA324I - AMD  - 3D model - BGA - CSG324
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XC7S50-2CSGA324I Details

  • Manufacturer Part Number:

    XC7S50-2CSGA324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S50-2CSGA324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7S50 is 500 MHz.
  • You can implement DDR3 memory interface with XC7S50 using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for DDR3 memory interface.
  • The power consumption of XC7S50 depends on the operating frequency, voltage, and other factors. According to the datasheet, the typical power consumption is around 1.5W at 100 MHz and 1.2V.
  • Yes, XC7S50 is suitable for high-reliability applications. It has features like single-event upset (SEU) mitigation, error correction, and built-in self-test (BIST) for ensuring reliability.
  • You can optimize the power consumption of XC7S50 by using power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.

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XC7S50-2CSGA324I Overview

Use the download button to access the XC7S50-2CSGA324I schematic symbol, PCB footprint, and 3D model.
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Part Image XC7S50-2CSGA324C AMD

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA324

Part Image XC7S50-2CSGA324I AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA324