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XC7S50-L1CSGA324I - AMD

Description: Spartan®-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA Voltage - Supply 0.92V ~ 0.98V Operating Temperature -40°C ~ 100°C (TJ)

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XC7S50-L1CSGA324I - AMD PCB footprint - BGA - BGA - CSG324
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XC7S50-L1CSGA324I - AMD  - 3D model - BGA - CSG324
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XC7S50-L1CSGA324I Details

  • Manufacturer Part Number:

    XC7S50-L1CSGA324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S50-L1CSGA324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7S50-L1CSGA324I is 500 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • The power consumption of the XC7S50-L1CSGA324I depends on the operating frequency, voltage, and usage. However, the typical power consumption is around 1.2W to 2.5W.
  • Yes, the XC7S50-L1CSGA324I is suitable for high-speed data acquisition applications due to its high-speed transceivers, high-bandwidth memory interfaces, and low-latency processing capabilities.
  • You can program the XC7S50-L1CSGA324I using the Xilinx Vivado Design Suite, which provides a comprehensive development environment for designing, implementing, and debugging FPGA-based systems.

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XC7S50-L1CSGA324I Overview

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