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XC7S50-L1FTGB196I - AMD

Description: XC7S50-L1FTGB196I

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XC7S50-L1FTGB196I - AMD PCB footprint - BGA - BGA - FTGB196
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XC7S50-L1FTGB196I - AMD  - 3D model - BGA - FTGB196
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XC7S50-L1FTGB196I Details

  • Manufacturer Part Number:

    XC7S50-L1FTGB196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e3

  • Length:

    15 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    100

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    100

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S50-L1FTGB196I Frequently Asked Questions (FAQs)

  • Xilinx provides a PCB design guide and layout recommendations in the '7 Series FPGAs PCB Design Guide' (UG583) and '7 Series FPGAs Packaging and Pinout' (UG475) documents. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet thermal requirements.
  • Xilinx provides power estimation tools and guidelines in the 'Xilinx Power Estimator' (XPE) and '7 Series FPGAs Power Management' (UG477) documents. Engineers should consider factors like clock frequency, voltage, and device utilization to minimize power consumption and heat generation.
  • The limitations and considerations for using hard IP blocks are documented in the '7 Series FPGAs IP Integrator' (UG894) and '7 Series FPGAs LogiCORE IP Product Guide' (PG182) documents. Engineers should review these resources to understand the IP block's functionality, configuration options, and potential limitations.
  • Xilinx provides guidelines for secure booting in the '7 Series FPGAs Configuration and Secure Boot' (UG470) document. Engineers should implement secure boot mechanisms, such as encryption and authentication, to prevent unauthorized access and ensure reliable booting.
  • Xilinx provides debugging and troubleshooting guidelines in the '7 Series FPGAs Debugging and Troubleshooting' (UG473) document. Engineers should use tools like ChipScope, Vivado Logic Analyzer, and the Xilinx Debug Hub to identify and resolve issues.

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XC7S50-L1FTGB196I Overview

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