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XC7VX415T-2FFG1157C - AMD

Description: Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 32440320 412160 1156-BBGA, FCBGA

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XC7VX415T-2FFG1157C - AMD PCB footprint - BGA - BGA - FFG1156_2023
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XC7VX415T-2FFG1157C - AMD  - 3D model - BGA - FFG1156_2023
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XC7VX415T-2FFG1157C Details

  • Manufacturer Part Number:

    XC7VX415T-2FFG1157C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1157

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B1157

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    32200

  • Number of Inputs:

    600

  • Number of Logic Cells:

    412160

  • Number of Outputs:

    600

  • Number of Terminals:

    1157

  • Operating Temperature-Max:

    85 °C

  • Organization:

    32200 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7VX415T-2FFG1157C Frequently Asked Questions (FAQs)

  • The XC7VX415T-2FFG1157C has a maximum operating temperature range of -40°C to 100°C.
  • Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808. The datasheet provides guidelines for implementing a POR circuit.
  • Xilinx provides guidelines for PCB layout and routing in the '7 Series FPGAs PCB Design Guide' (UG483). It's essential to follow these guidelines to ensure signal integrity, reduce noise, and prevent electromagnetic interference (EMI).
  • The XC7VX415T-2FFG1157C has a complex clocking architecture. Xilinx recommends using the Clocking Wizard tool in Vivado Design Suite to configure the clocking architecture for optimal performance. The tool helps to generate clocking IP, configure clock domains, and optimize clock routing.
  • The XC7VX415T-2FFG1157C has limited block RAM (BRAM) and distributed RAM resources. Engineers should carefully plan their memory usage, considering factors like data width, depth, and access patterns. Xilinx provides guidelines for memory resource planning in the '7 Series FPGAs Memory Resources User Guide' (UG473).

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XC7VX415T-2FFG1157C Overview

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