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XC7VX485T-2FFG1157C - AMD

Description: FPGA - Field Programmable Gate Array XC7VX485T-2FFG1157C

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XC7VX485T-2FFG1157C Details

  • Manufacturer Part Number:

    XC7VX485T-2FFG1157C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1157

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B1157

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Number of CLBs:

    37950

  • Number of Inputs:

    600

  • Number of Logic Cells:

    485760

  • Number of Outputs:

    600

  • Number of Terminals:

    1157

  • Operating Temperature-Max:

    85 °C

  • Organization:

    37950 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XC7VX485T-2FFG1157C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7VX485T-2FFG1157C is 550 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • The XC7VX485T-2FFG1157C has a total of 2,970 Kbits of block RAM, 37,440 Kbits of distributed RAM, and 1,280 Kbits of ROM.
  • Yes, the XC7VX485T-2FFG1157C is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial markets. It has a high mean time between failures (MTBF) and is manufactured using a robust process.
  • The available development tools for the XC7VX485T-2FFG1157C include the Xilinx Vivado Design Suite, ISE Design Suite, and the Xilinx Software Development Kit (SDK).

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XC7VX485T-2FFG1157C Overview

Use the download button to access the XC7VX485T-2FFG1157C 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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Image Part Number Model
Part Image XC7VX485T-2FF1157C AMD

Field Programmable Gate Array, 37950 CLBs, 1818MHz, 485760-Cell, CMOS, PBGA1157

Part Image XC7VX485T-2FFG1157C AMD Xilinx

Field Programmable Gate Array, 37950 CLBs, 1818MHz, 485760-Cell, CMOS, PBGA1157

Part Image XC7VX485T-2FF1157C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 485760-Cell, CMOS, PBGA1156

Part Image XC7VX485T-2FF1157I AMD Xilinx

Field Programmable Gate Array, 1818MHz, 485760-Cell, CMOS, PBGA1156

Part Image XC7VX485T-2FFG1157E AMD Xilinx

Field Programmable Gate Array, 75900 CLBs, PBGA1157

For a full list of alternate parts for XC7VX485T-2FFG1157C, check out Findchips.com