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XC7Z035-2FFG900I - AMD

Description: Processors - Application Specialized XC7Z035-2FFG900I

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XC7Z035-2FFG900I - AMD PCB footprint - BGA - BGA - FFG900
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XC7Z035-2FFG900I - AMD  - 3D model - BGA - FFG900
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XC7Z035-2FFG900I Details

  • Manufacturer Part Number:

    XC7Z035-2FFG900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Moisture Sensitivity Level:

    4

  • Peak Reflow Temperature (Cel):

    245

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Time@Peak Reflow Temperature-Max (s):

    30

XC7Z035-2FFG900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of XC7Z035-2FFG900I is approximately 2.5W, but it can vary depending on the design and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies and voltage. Additionally, use the lowest possible voltage and frequency for your design.
  • The maximum operating frequency of XC7Z035-2FFG900I is 350 MHz, but it can vary depending on the design and operating conditions.
  • To implement a DDR3 memory interface, use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 controller IP core, and then integrate it into your design.
  • The maximum bandwidth of the PCIe interface in XC7Z035-2FFG900I is x4 Gen2, which is approximately 16 GB/s.

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XC7Z035-2FFG900I Overview

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