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XCKU115-2FLVD1517I - AMD

Description: IC FPGA 338 I/O 1517FCBGA

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XCKU115-2FLVD1517I - AMD PCB footprint - BGA - BGA - FLVA1517
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XCKU115-2FLVD1517I - AMD  - 3D model - BGA - FLVA1517
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XCKU115-2FLVD1517I Details

  • Manufacturer Part Number:

    XCKU115-2FLVD1517I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5520

  • Number of Inputs:

    832

  • Number of Logic Cells:

    1451100

  • Number of Outputs:

    832

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5520 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.09 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

XCKU115-2FLVD1517I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU115-2FLVD1517I is approximately 25W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU115-2FLVD1517I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance routing, and add termination resistors as needed. Additionally, use the FPGA's built-in features, such as signal conditioning and deskew, to improve signal quality.
  • The maximum clock frequency supported by the XCKU115-2FLVD1517I is 500 MHz, but it can vary depending on the specific device grade, voltage, and operating conditions.

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XCKU115-2FLVD1517I Overview

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Part Image XCKU115-2FLVD1517I AMD Xilinx

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Part Image XCKU115-2FLVA1517I AMD Xilinx

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Part Image XCKU115-2FLVD1517E AMD Xilinx

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