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XCKU11P-1FFVA1156I - AMD

Description: FPGA - Field Programmable Gate Array XCKU11P-1FFVA1156I

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XCKU11P-1FFVA1156I Details

  • Manufacturer Part Number:

    XCKU11P-1FFVA1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    37320

  • Number of Inputs:

    512

  • Number of Logic Cells:

    653100

  • Number of Outputs:

    512

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    37320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XCKU11P-1FFVA1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU11P-1FFVA1156I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU11P-1FFVA1156I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx PCB design guidelines, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as input/output delay calibration and signal conditioning.
  • The maximum clock frequency supported by the XCKU11P-1FFVA1156I is 1.2 GHz, but it can vary depending on the specific device grade, operating conditions, and design implementation.

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XCKU11P-1FFVA1156I Overview

Use the download button to access the XCKU11P-1FFVA1156I 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XCKU1, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XCKU11P-1FFVA1156E AMD

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156

Part Image XCKU11P-1FFVA1156E AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156

Part Image XCKU11P-1FFVA1156I AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156