XCKU15P-2FFVA1156E footprint, schematic symbol and 3D model by AMD

Symbol

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PCB Footprints

XCKU15P-2FFVA1156E - AMD PCB footprint - BGA - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)

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3D Models

XCKU15P-2FFVA1156E - AMD - 3D model - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)

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Datasheet Download Datasheet
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Part Number XCKU15P-2FFVA1156E
Manufacturer AMD
Pin Count 1156
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
Released Date Nov 27, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

XCKU15P-2FFVA1156E Details

Manufacturer Part Number:
XCKU15P-2FFVA1156E
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
BGA-1156
Country Of Origin:
Taiwan
HTS Code:
8542.31.00.60
Factory Lead Time:
16 Weeks
Manufacturer:
AMD
YTEOL:
10
JESD-30 Code:
S-PBGA-B1156
JESD-609 Code:
e1
Length:
35 mm
Moisture Sensitivity Level:
4
Number of CLBs:
65340
Number of Inputs:
668
Number of Logic Cells:
1143450
Number of Outputs:
668
Number of Terminals:
1156
Operating Temperature-Max:
100 °C
Organization:
65340 CLBs
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA1156,34X34,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
245
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max:
3.71 mm
Supply Voltage-Max:
0.876 V
Supply Voltage-Min:
0.825 V
Supply Voltage-Nom:
0.85 V
Surface Mount:
YES
Technology:
16 nm
Temperature Grade:
OTHER
Terminal Finish:
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Width:
35 mm

XCKU15P-2FFVA1156E Frequently Asked Questions (FAQs)

The maximum power consumption of the XCKU15P-2FFVA1156E is approximately 12W, but this can vary depending on the specific design and usage.
To optimize power consumption, use the Vivado Power Analysis tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
The maximum clock frequency supported by the XCKU15P-2FFVA1156E is 500 MHz, but this can vary depending on the specific design and usage.
To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, and follow best practices for PCB design, such as using differential pairs, minimizing trace length, and using signal shielding.
The XCKU15P-2FFVA1156E is rated for operation in the commercial temperature range of 0°C to 85°C, but can be operated in the industrial temperature range of -40°C to 100°C with reduced performance and reliability.

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XCKU15P-2FFVA1156E Overview

Use the download button to access the XCKU15P-2FFVA1156E schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like XCKU1, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to XCKU15P-2FFVA1156E

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Image	Part Number	Model
	XCKU15P-2FFVA1156I AMD Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1156
	XCKU15P-2FFVA1156E AMD Xilinx Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1156
	XCKU15P-2FFVA1156I AMD Xilinx Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1156
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XCKU15P-2FFVA1156E - AMD

XCKU15P-2FFVA1156E Details

XCKU15P-2FFVA1156E Frequently Asked Questions (FAQs)

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XCKU15P-2FFVA1156E Overview

Parts related to XCKU15P-2FFVA1156E

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