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XCKU3P-1FFVB676I - AMD

Description: IC FPGA 280 I/O 676FCBGA

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XCKU3P-1FFVB676I - AMD - PCB symbol
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XCKU3P-1FFVB676I - AMD PCB footprint - BGA - BGA - FFVB676,
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XCKU3P-1FFVB676I - AMD - 3D model - BGA - FFVB676,
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XCKU3P-1FFVB676I Details

  • Manufacturer Part Number:

    XCKU3P-1FFVB676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    20340

  • Number of Inputs:

    304

  • Number of Logic Cells:

    355950

  • Number of Outputs:

    304

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    20340 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XCKU3P-1FFVB676I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU3P-1FFVB676I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU3P-1FFVB676I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx PCB Design Guide, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Signal Integrity Wizard to analyze and optimize your design.
  • The maximum clock frequency supported by the XCKU3P-1FFVB676I is 500 MHz, but it can vary depending on the specific device grade, voltage, and operating conditions.

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XCKU3P-1FFVB676I Overview

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Part Image XCKU3P-1FFVB676I AMD Xilinx

Field Programmable Gate Array, 20340 CLBS, 355950-Cell, PBGA676