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XCKU5P-1SFVB784I - AMD

Description: Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 41984000 474600 784-BFBGA, FCBGA 0.825V ~ 0.876V,-40°C ~ 100°C (TJ)

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PCB Footprints
XCKU5P-1SFVB784I - AMD PCB footprint - BGA - BGA - SFVB784
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XCKU5P-1SFVB784I - AMD  - 3D model - BGA - SFVB784
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XCKU5P-1SFVB784I Details

  • Manufacturer Part Number:

    XCKU5P-1SFVB784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    27120

  • Number of Inputs:

    304

  • Number of Logic Cells:

    474600

  • Number of Outputs:

    304

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    27120 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XCKU5P-1SFVB784I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU5P-1SFVB784I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU5P-1SFVB784I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as input/output delay calibration and signal conditioning.
  • The maximum clock frequency supported by the XCKU5P-1SFVB784I is 500 MHz, but it can vary depending on the specific design, clock domain, and operating conditions.

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XCKU5P-1SFVB784I Overview

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Part Image XCKU5P-1SFVB784E AMD

Field Programmable Gate Array, 27120 CLBS, 474600-Cell, PBGA784

Part Image XCKU5P-1SFVB784I AMD Xilinx

Field Programmable Gate Array, 27120 CLBS, 474600-Cell, PBGA784