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XCKU9P-1FFVE900E - AMD

Description: XCKU9P-1FFVE900E

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XCKU9P-1FFVE900E - AMD PCB footprint - BGA - BGA - FFVE900
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XCKU9P-1FFVE900E - AMD  - 3D model - BGA - FFVE900
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XCKU9P-1FFVE900E Details

  • Manufacturer Part Number:

    XCKU9P-1FFVE900E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    34260

  • Number of Inputs:

    304

  • Number of Logic Cells:

    599550

  • Number of Outputs:

    304

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Organization:

    34260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XCKU9P-1FFVE900E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU9P-1FFVE900E is approximately 25W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU9P-1FFVE900E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as deskew and phase alignment, to minimize signal degradation.
  • The maximum bandwidth of the XCKU9P-1FFVE900E's high-speed transceivers is 32.75 Gbps, making them suitable for high-speed applications such as 10G Ethernet, PCIe, and SATA.

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XCKU9P-1FFVE900E Overview

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Part Image XCKU9P-1FFVE900I AMD Xilinx

Field Programmable Gate Array, 34260 CLBS, 599550-Cell, PBGA900