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XCR3128XL-10VQ100C - AMD

Description: CPLD - Complex Programmable Logic Devices XCR3128XL-10VQ100C

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XCR3128XL-10VQ100C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQFP-100
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XCR3128XL-10VQ100C - AMD  - 3D model - Quad Flat Packages - VQFP-100
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XCR3128XL-10VQ100C Details

  • Manufacturer Part Number:

    XCR3128XL-10VQ100C

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    95 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    84

  • Number of Inputs:

    84

  • Number of Macro Cells:

    128

  • Number of Outputs:

    84

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 84 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XCR3128XL-10VQ100C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCR3128XL-10VQ100C is -40°C to 100°C (industrial grade) and 0°C to 70°C (commercial grade).
  • Clock signal routing for the XCR3128XL-10VQ100C requires careful attention to signal integrity, skew, and jitter. AMD recommends using a clock tree architecture with a central clock source and distributing it to the various clock domains using a combination of clock buffers and clock distribution networks.
  • The recommended power-up sequence for the XCR3128XL-10VQ100C is to apply power to the VCCINT and VCCAUX power rails simultaneously, followed by the VCCO power rail. The power-up sequence should be controlled to ensure that the voltage rails rise monotonically and within the specified voltage tolerance.
  • To optimize the XCR3128XL-10VQ100C for low power consumption, AMD recommends using power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, optimizing the design for low power consumption requires careful attention to clock frequency, voltage, and leakage power reduction techniques.
  • The recommended PCB layout guidelines for the XCR3128XL-10VQ100C include using a multi-layer PCB with a solid ground plane, separating analog and digital signals, and minimizing signal trace lengths and vias. AMD also recommends following the JEDEC JESD51-7 standard for thermal design and the IPC-7351 standard for land pattern design.

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XCR3128XL-10VQ100C Overview

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Part Image XCR3128XL-10VQG100C AMD Xilinx

EE PLD, 10ns, 128-Cell, CMOS, PQFP100

Part Image XCR3128XL-10VQ100I AMD Xilinx

EE PLD, 10ns, 128-Cell, CMOS, PQFP100

Part Image XCR3128XL-10VQ100I AMD

EE PLD, 10ns, 128-Cell, CMOS, PQFP100

Part Image XCR3128XL-10VQG100C AMD

EE PLD, 10ns, 128-Cell, CMOS, PQFP100

Part Image XCR3128XL-10VQ100Q AMD Xilinx

EE PLD, 10ns, 128-Cell, CMOS, PQFP100

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