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XCR3512XL-10FT256I - AMD

Description: CPLD - Complex Programmable Logic Devices XCR3512XL-10FT256I

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XCR3512XL-10FT256I - AMD PCB footprint - BGA - BGA - 256-LBGA
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XCR3512XL-10FT256I - AMD  - 3D model - BGA - 256-LBGA
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XCR3512XL-10FT256I Details

  • Manufacturer Part Number:

    XCR3512XL-10FT256I

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-256

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.d

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    97 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    212

  • Number of Inputs:

    212

  • Number of Macro Cells:

    512

  • Number of Outputs:

    212

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 212 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XCR3512XL-10FT256I Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the XCR3512XL-10FT256I, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance, power efficiency, and thermal management.
  • The XCR3512XL-10FT256I requires a specific power sequencing and voltage regulation scheme. AMD recommends using a dedicated power management IC (PMIC) or a custom power management design that meets the device's power requirements. The datasheet provides guidelines for power sequencing and voltage regulation, but additional design considerations may be necessary.
  • While the datasheet provides some information on operating conditions, it's essential to understand the recommended operating ranges for temperature, voltage, and frequency to ensure reliable operation. AMD recommends operating the device within the specified temperature range (-40°C to 125°C), voltage range (1.0V to 1.2V), and frequency range (up to 1.2 GHz) to ensure optimal performance and reliability.
  • Optimizing the XCR3512XL-10FT256I's performance requires a deep understanding of the device's architecture, instruction set, and memory hierarchy. AMD provides software development kits (SDKs) and application notes that can help engineers optimize their code and system design for specific applications. Additionally, AMD's technical support team can provide guidance on performance optimization.
  • The XCR3512XL-10FT256I, like any high-frequency device, can be a source of EMI. To mitigate EMI, engineers should follow best practices for PCB design, component selection, and shielding. AMD recommends using EMI filters, shielding, and proper grounding techniques to minimize EMI emissions and ensure compliance with regulatory requirements.

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XCR3512XL-10FT256I Overview

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