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XCVU9P-1FLGB2104E - AMD

Description: FPGA - Field Programmable Gate Array XCVU9P-1FLGB2104E

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XCVU9P-1FLGB2104E Details

  • Manufacturer Part Number:

    XCVU9P-1FLGB2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • Length:

    47.5 mm

  • Number of CLBs:

    147780

  • Number of Inputs:

    832

  • Number of Logic Cells:

    2586150

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    147780 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    47.5 mm

XCVU9P-1FLGB2104E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU9P-1FLGB2104E is approximately 26W, but this can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and optimize the design for low power consumption. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCVU9P-1FLGB2104E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow best practices for PCB design, such as using controlled impedance, minimizing signal routing, and using termination resistors. Additionally, use the Vivado Design Suite to analyze and optimize signal integrity, and consider using the FPGA's built-in signal conditioning features.
  • The maximum bandwidth of the XCVU9P-1FLGB2104E's transceivers is 32.75 Gbps per lane, with a total bandwidth of up to 1.6 Tbps for the entire device.

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XCVU9P-1FLGB2104E Overview

Use the download button to access the XCVU9P-1FLGB2104E 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XCVU9, or try a keyword search, such as Field Programmable Gate Arrays

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