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XCVU9P-2FLGB2104E - AMD

Description: AMD - XILINX - XCVU9P-2FLGB2104E - FPGA, VIRTEX ULTRASCALE+, FCBGA-2104

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PCB Footprints
XCVU9P-2FLGB2104E - AMD PCB footprint - BGA - BGA - FLGB2104E
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XCVU9P-2FLGB2104E - AMD  - 3D model - BGA - FLGB2104E
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XCVU9P-2FLGB2104E Details

  • Manufacturer Part Number:

    XCVU9P-2FLGB2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • JESD-609 Code:

    e1

  • Length:

    47.5 mm

  • Number of CLBs:

    147780

  • Number of Inputs:

    832

  • Number of Logic Cells:

    2586150

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    147780 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    47.5 mm

XCVU9P-2FLGB2104E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU9P-2FLGB2104E is approximately 26W, but this can vary depending on the specific design, clock frequency, and usage.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD Power Estimator (APE) tool to estimate power consumption early in the design cycle.
  • The maximum operating temperature of the XCVU9P-2FLGB2104E is 100°C (junction temperature), but it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, consider using differential signaling, and follow AMD's guidelines for PCB design and layout. Additionally, use the FPGA's built-in features, such as signal conditioning and termination, to improve signal quality.
  • The maximum bandwidth of the XCVU9P-2FLGB2104E's high-speed transceivers is 32.75 Gbps, making them suitable for high-speed applications such as PCIe, Ethernet, and other high-bandwidth interfaces.

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XCVU9P-2FLGB2104E Overview

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Field Programmable Gate Array, 147780 CLBS, 2586150-Cell, PBGA2104

Part Image XCVU9P-2FLGB2104E AMD Xilinx

Field Programmable Gate Array, 147780 CLBS, 2586150-Cell, PBGA2104

Part Image XCVU9P-2FLGB2104I AMD Xilinx

Field Programmable Gate Array, 2586150-Cell, PBGA2104

Part Image XCVU9P-2LFLGB2104E AMD Xilinx

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