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XCZU9EG-2FFVB1156I - AMD

Description: XILINX - XCZU9EG-2FFVB1156I - MPSOC, ARM CORTEX-A53/R5, FCBGA-1156

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XCZU9EG-2FFVB1156I - AMD PCB footprint - BGA - BGA - FFVB1156 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-2FFVB1156I - AMD  - 3D model - BGA - FFVB1156 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-2FFVB1156I Details

  • Manufacturer Part Number:

    XCZU9EG-2FFVB1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B1156

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    34260

  • Number of Inputs:

    328

  • Number of Logic Cells:

    599550

  • Number of Outputs:

    328

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    34260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XCZU9EG-2FFVB1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU9EG-2FFVB1156I is approximately 15W, but this can vary depending on the specific application and usage.
  • To implement a DDR4 memory interface on the XCZU9EG-2FFVB1156I, you can use the MIG (Memory Interface Generator) tool in Vivado to generate a DDR4 controller and PHY. You will also need to ensure that the PCB is designed to meet the DDR4 signal integrity requirements.
  • Yes, the XCZU9EG-2FFVB1156I is capable of supporting high-speed serial interfaces like PCIe and 10GbE. The device has dedicated transceivers that can operate at speeds up to 32.75 Gb/s, making it suitable for high-speed applications.
  • To secure your design on the XCZU9EG-2FFVB1156I, you can use the built-in security features such as the AES-256 encryption engine, secure boot mechanisms, and bitstream encryption. Additionally, you can implement your own security protocols and algorithms using the FPGA's programmable logic.
  • The maximum operating frequency of the XCZU9EG-2FFVB1156I depends on the specific application and design. However, the device is capable of operating at frequencies up to 500 MHz, and in some cases, even higher frequencies may be achievable with careful design and optimization.

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XCZU9EG-2FFVB1156I Overview

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