XQVR1000-4CGG560Q - AMD

XQVR1000-4CGG560Q Details

• Manufacturer Part Number:

  XQVR1000-4CGG560Q

• Part Life Cycle Code:

  Active

• Package Description:

  HEAT SINK, CERAMIC, CGA-560

• ECCN Code:

  3A001.a.2.c

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  4

• JESD-30 Code:

  S-CBGA-X560

• JESD-609 Code:

  e3

• Length:

  42.5 mm

• Number of CLBs:

  6144

• Number of Equivalent Gates:

  1124022

• Number of Logic Cells:

  27648

• Number of Terminals:

  560

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Organization:

  6144 CLBS, 1124022 GATES

• Package Body Material:

  CERAMIC, METAL-SEALED COFIRED

• Package Code:

  HCGA

• Package Equivalence Code:

  CGA560,33X33,50

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, HEAT SINK/SLUG

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Screening Level:

  MIL-PRF-38535 Class Q

• Seated Height-Max:

  4.9 mm

• Supply Voltage-Max:

  2.625 V

• Supply Voltage-Min:

  2.375 V

• Supply Voltage-Nom:

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS, 220 nm

• Temperature Grade:

  MILITARY

• Terminal Form:

  UNSPECIFIED

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Total Dose:

  100k Rad(Si) V

• Width:

  42.5 mm