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XR20M1170IG24-F - MaxLinear, Inc.

Description: IC UART FIFO I2C/SPI 64B 24TSSOP

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PCB Footprints
XR20M1170IG24-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP_24
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XR20M1170IG24-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - TSSOP_24
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XR20M1170IG24-F Details

  • Manufacturer Part Number:

    XR20M1170IG24-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    0

  • Boundary Scan:

    NO

  • Bus Compatibility:

    I2C; UART

  • Clock Frequency-Max:

    64 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    2 MBps

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    8

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR20M1170IG24-F Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use a shielded cable or a twisted pair for the differential signals, and keep the signal traces as short as possible. Also, ensure a common mode choke or a ferrite bead is used to filter out high-frequency noise.
  • Power up the device in the following sequence: VCC, then VDD, and finally the input signals. Ensure a minimum of 10ms delay between power-up and signal application. The reset pin should be held low for at least 10ms during power-up.
  • Consult the application note AN-202 from MaxLinear Inc, which provides guidelines for optimizing the device's performance for specific applications, including transmitter and receiver equalization, and clock recovery.
  • Use a high-speed oscilloscope with a bandwidth of at least 10 GHz to measure the device's output. Ensure the measurement setup is calibrated and the probes are properly terminated. Consult the device's datasheet and application notes for specific measurement procedures.

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XR20M1170IG24-F Overview

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