1586038-8 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout Matrix | Contact Layo