2-2822979-4 - TE Connectivity

Description: Body Features: Frame Style Square | Configuration Features: Number of Positions 3647 | Grid Spacing .9906 x .8585 MM | Grid Spacing .039 x .0338 INCH | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | IC Socket Type LGA 3647 | Housing Features: Housing Color Black | Centerline (Pitch) .99 MM | Centerline (Pitch) .86 MM | Centerline (Pitch) .034 INCH | Centerline (