2227669-2 - TE Connectivity

Description: Configuration Features: Number of Positions 76 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness