225686-E - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 1 | Contact Features: Contact Mating Area Plating Material Thickness 2 – 6 MICM | Contact Underplating Material Thickness 39.37 – 118.11 MICIN | Contact Mating Area Plating Material Finish Matte | Contact Underplating Material Thickness 1 – 3 MICM | Contact Underplating Material Copper | Contact Type Socket | Contact Mating Area Plating Material Thickness 78.74 – 236.22 MICIN | Contact Mating Area Plating Material Tin (Sn)