Description: Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Type Pin | Contact Current R