556881-2 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 35 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Shape & Form Dual Beam | Contact Rete