6450830-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 8 | Number of Positions 12 | Number of Power Positions 4 | Number of Rows 4 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Type Pin | Contact Type Blade | Power Contact Base Material Tin | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Co