6600330-4 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Signal Positions 24 | Mating & Unmating Configuration Sequencing | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Thickness 5.97 MICM | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Power Contact Base Material Tin | Contact Mat