A3M40PD012 - NXP
Description: thermal enhanced low profile fine-pitch land grid array package, 13 terminals, 0.5 mm pitch, 2.2 mm x 2.2 mm x 0.68 mm body
Description: thermal enhanced low profile fine-pitch land grid array package, 13 terminals, 0.5 mm pitch, 2.2 mm x 2.2 mm x 0.68 mm body
