FDMT1D3N08B - onsemi

Description: Low Profile 8x8mm MLP Package ; MSL1 Robust Package Design ; Next Generation Enhanced Body Diode Technology, Engineered for Soft Recovery ; 100% UIL Tested ; Max rDS(on) = 1.35 mΩ at VGS = 10 V, ID = 36 A ; Max rDS(on) = 1.8 mΩ at VGS = 8 V, ID = 31 A ; RoHS Compliant ; Advanced Package and Silicon Combination for Low rDS(on)and High Efficiency