Part Image

FSV2050V - onsemi

Description: Low Thermal Resistance; Very Low Profile: Typical Height of 1.1 mm; Qualified with Reflow (J-STD-020) and Solder Temperature 260°C Classification; Lead Free in Compliance with EU RoHS 2011/65/EU Directive; RoHS Compliant; Ultra Low Forward Voltage Drop; Green Molding Compound as per IEC61249 Standard

Download FSV2050V Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
Zoom
Zoom Full Zoom Full
Drag mouse to rotate
Mouse wheel to zoom