MBRF20100CTG - onsemi

Description: Case: Epoxy, Molded; Electrically Isolated. No Isolation Hardware Required.; High dv/dt Capability; Matched Dual Die Construction; Weight: 1.9 grams (approximately); High Junction Temperature Capability; Guardring for Stress Protection; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Marking: B20100; Lead Temperature for Solde