MURH860CTG - onsemi

Description: Case: Epoxy, Molded; Weight: 1.9 grams (approximately); High Voltage Capability to 600 Volts; Low Leakage Specified @ 150 C Case Temperature; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; 175 C Operating Junction Temperature; Shipped 50 units per plastic tube; Popular TO-220 Package; High Temperature Glass Passivated Junction; Ultrafast 35 Nanosecond Recovery Times; Finish: All External Surfaces Corrosio