NDS332P - onsemi

Description: Proprietary package design using copper lead frame for superior thermal and electrical capabilities; High density cell design for extremely low RDS(ON); Very low level gate drive requirements allowing direct operation in 3V circuits VGS(th) < 1.0V; -1 A, -20 V RDS(ON) = 0.41Ω @ VGS= -2.7 V RDS(ON) = 0.3 Ω @ VGS = -4.5 V; Exceptional on-resistance and maximum DC current capability; Compact industry standard SOT-23 surface Mount package