Part Image

SA58672TK - NXP

Description: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm.

Download SA58672TK Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
    Zoom
    Zoom Full
    Middle click on footprint to measure