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SA58672TK - NXP

Description: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm.

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Symbol
SA58672TK - NXP - PCB symbol
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PCB Footprints
SA58672TK - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT650-1-1
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3D Models
SA58672TK - NXP - 3D model - Small Outline No-lead - SOT650-1-1
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SA58672TK Details

  • Manufacturer Part Number:

    SA58672TK

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT650-1, HVSON-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    4.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SA58672TK Frequently Asked Questions (FAQs)

  • A good PCB layout for the SA58672TK involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Also, ensure that the bias resistors (R1 and R2) are correctly sized to provide the recommended 1.4V bias voltage at the output.
  • The maximum power dissipation of the SA58672TK is 1.2W. To prevent overheating, ensure good thermal conductivity by using a heat sink or a thermal pad, and keep the device away from other heat sources. Also, make sure to follow the recommended operating conditions and avoid exceeding the maximum junction temperature of 150°C.
  • To troubleshoot common issues, start by checking the PCB layout and ensuring that it meets the recommended layout guidelines. Verify that the power supply is stable and within the recommended range. Check for any signs of overheating, and ensure that the device is properly biased. If issues persist, consult the application notes and datasheet for further guidance.
  • Yes, the SA58672TK is a high-frequency device, and as such, it's essential to take EMI/EMC considerations into account. Ensure that the PCB layout is designed to minimize radiation, use shielding where necessary, and follow good EMC design practices. Additionally, consider using EMI filters or absorbers to reduce electromagnetic interference.

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SA58672TK Overview

Use the download button to access the SA58672TK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SA586, or try a keyword search, such as Audio/Video Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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