SE10FGHM3/H - Vishay

Description: • Low profile package • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • ESD capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912