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0430450829 - Molex

Description: Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 8 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black

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Symbol
0430450829 - Molex - PCB symbol
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PCB Footprints
0430450829 - Molex PCB footprint - Other - Other - 0430450829-2
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3D Models
0430450829 - Molex - 3D model - Other - 0430450829-2
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0430450829 Details

  • Manufacturer Part Number:

    0430450829

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan, Mainland China, Mexico, Puerto Rico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8

0430450829 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-1.5 Nm (4-12 in-lbs).
  • Yes, the 0430450829 connector is designed to withstand vibrations and is suitable for use in applications with moderate to high vibration levels.
  • The operating temperature range for the 0430450829 connector is -40°C to 105°C (-40°F to 221°F).
  • Yes, the 0430450829 connector is designed to be resistant to harsh environments, including high humidity and exposure to certain chemicals. However, it's recommended to consult the datasheet and Molex's environmental testing reports for specific details.
  • No, the 0430450829 connector is designed for use with wire gauges 20 AWG to 24 AWG. Using a larger wire gauge may compromise the connector's performance and reliability.

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0430450829 Overview

Use the download button to access the 0430450829 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 04304, or try a keyword search, such as Power Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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