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10AS016E4F27E3SG - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 160K Logic Elements 1.5GHz 672-FBGA, FC (27x27)

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PCB Footprints
10AS016E4F27E3SG - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid A:3.35
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3D Models
10AS016E4F27E3SG - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid A:3.35
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10AS016E4F27E3SG Details

  • Manufacturer Part Number:

    10AS016E4F27E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    27 mm

  • Number of CLBs:

    6151

  • Number of Inputs:

    240

  • Number of Logic Cells:

    160000

  • Number of Outputs:

    240

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Organization:

    6151 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

10AS016E4F27E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AS016E4F27E3SG FPGA is approximately 2.5W, but this can vary depending on the specific design and usage.
  • To implement a CDC in the 10AS016E4F27E3SG FPGA, you can use Intel's recommended CDC techniques, such as using asynchronous FIFOs or synchronizers, and follow the guidelines provided in the Intel FPGA Clock Domain Crossing User Guide.
  • The maximum frequency achievable with the 10AS016E4F27E3SG FPGA depends on the specific design and implementation, but Intel recommends a maximum clock frequency of 300 MHz for most applications.
  • To optimize the FPGA design for power consumption, use Intel's Power Analyzer tool to identify power-hungry components, and apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • To implement a DDR3 memory interface in the 10AS016E4F27E3SG FPGA, use Intel's DDR3 IP core, which provides a pre-verified and optimized interface for DDR3 memory devices.

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