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10AS016E4F29E3SG - Intel

Description: FPGA Arria® 10 SX Family 160000 Cells 20nm Technology 0.9V 780-Pin FBGA Tray

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PCB Footprints
10AS016E4F29E3SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AS016E4F29E3SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AS016E4F29E3SG Details

  • Manufacturer Part Number:

    10AS016E4F29E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    6151

  • Number of Inputs:

    288

  • Number of Logic Cells:

    160000

  • Number of Outputs:

    288

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    6151 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AS016E4F29E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AS016E4F29E3SG FPGA is approximately 2.5W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock gating.
  • To optimize your design for area and performance, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize For' feature, which allows you to target specific design goals, such as area or speed. Additionally, consider using Intel's IP cores and optimized design examples.
  • To ensure signal integrity in your design, follow Intel's guidelines for signal routing, including using differential signaling, minimizing signal length, and using Intel's signal integrity analysis tools. Additionally, consider using Intel's built-in signal conditioning features, such as the 'Signal Tap' feature.
  • The recommended design flow for implementing a design on the 10AS016E4F29E3SG FPGA includes: 1) design entry using HDL or schematic capture, 2) synthesis using Intel's Quartus Prime software, 3) placement and routing, 4) timing analysis and optimization, and 5) device programming and verification.

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10AS016E4F29E3SG Overview

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