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10AS048H3F34E2SG - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 480K Logic Elements 256KB 1.5GHz 1152-FBGA, FC (35x35)

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PCB Footprints
10AS048H3F34E2SG - Intel PCB footprint - BGA - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AS048H3F34E2SG - Intel  - 3D model - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AS048H3F34E2SG Details

  • Manufacturer Part Number:

    10AS048H3F34E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    18359

  • Number of Inputs:

    384

  • Number of Logic Cells:

    480000

  • Number of Outputs:

    384

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Organization:

    18359 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AS048H3F34E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AS048H3F34E2SG FPGA is approximately 2.5W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock gating.
  • To optimize your design for area and speed, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize for Area' and 'Optimize for Speed' options, as well as using the 'Design Space Explorer' to explore different design trade-offs.
  • To ensure reliable data transfer between different clock domains, use Intel's recommended clock domain crossing (CDC) techniques, such as using synchronizers, FIFOs, or asynchronous FIFOs. Additionally, ensure that your design meets Intel's guidelines for CDC.
  • To implement a reliable reset strategy, use a synchronous reset signal, ensure that all registers are reset simultaneously, and use a reset synchronizer to ensure that the reset signal is properly synchronized across clock domains.

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