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10AX016E4F29E3SG - Intel

Description: FPGA - Field Programmable Gate Array Arria 10 GX 160 FPGA

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PCB Footprints
10AX016E4F29E3SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX016E4F29E3SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX016E4F29E3SG Details

  • Manufacturer Part Number:

    10AX016E4F29E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    6151

  • Number of Inputs:

    288

  • Number of Logic Cells:

    160000

  • Number of Outputs:

    288

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    6151 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AX016E4F29E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX016E4F29E3SG is approximately 2.5W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
  • To optimize your design, use Intel's Quartus Prime software to analyze and optimize your design. This includes using the 'Optimize For' feature, which allows you to target specific design goals such as area, speed, or power. Additionally, consider using Intel's IP cores and optimized design examples to reduce area and improve performance.
  • To ensure signal integrity and reduce EMI, follow Intel's guidelines for signal routing, termination, and shielding. This includes using differential signaling, adding termination resistors, and using Intel's recommended PCB layout and stack-up guidelines.
  • Intel recommends using the Quartus Prime software for design entry, synthesis, and implementation. Additionally, use Intel's ModelSim-Altera simulator for functional verification and the SignalTap II logic analyzer for debugging and signal analysis.

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