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10AX027E3F29E2SG - Intel

Description: FPGA Arria® 10 GX Family 270000 Cells 20nm Technology 0.9V 780-Pin FC-FBGA

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PCB Footprints
10AX027E3F29E2SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX027E3F29E2SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX027E3F29E2SG Details

  • Manufacturer Part Number:

    10AX027E3F29E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    10162

  • Number of Inputs:

    360

  • Number of Logic Cells:

    270000

  • Number of Outputs:

    360

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    10162 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AX027E3F29E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX027E3F29E2SG is approximately 12W, but this can vary depending on the specific use case and design implementation.
  • Intel recommends using a clocking scheme that includes a dedicated clock network, clock domain crossing, and clock gating to ensure reliable and efficient clocking. Additionally, using Intel's Clocking Wizard tool can help simplify the clocking design process.
  • To optimize the 10AX027E3F29E2SG for low power consumption, use Intel's PowerPlay power analysis tool to identify power-hungry components and optimize the design accordingly. Additionally, use power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • To ensure signal integrity on the 10AX027E3F29E2SG, use Intel's Signal Integrity Tool to analyze and optimize signal paths. Additionally, follow best practices for PCB design, such as using differential signaling, minimizing trace lengths, and using termination resistors.
  • The recommended design flow for the 10AX027E3F29E2SG includes using Intel's Quartus Prime design software for RTL design, synthesis, and place-and-route. Additionally, use Intel's ModelSim simulation tool for functional verification and timing analysis.

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10AX027E3F29E2SG Overview

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