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10AX027E4F29I3SG - Intel

Description: FPGA - Field Programmable Gate Array Arria 10 GX 270 FPGA

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PCB Footprints
10AX027E4F29I3SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX027E4F29I3SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX027E4F29I3SG Details

  • Manufacturer Part Number:

    10AX027E4F29I3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    10162

  • Number of Inputs:

    360

  • Number of Logic Cells:

    270000

  • Number of Outputs:

    360

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10162 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AX027E4F29I3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX027E4F29I3SG is approximately 2.5W, but this can vary depending on the specific design and usage.
  • To implement a DDR3 memory interface on the 10AX027E4F29I3SG, you need to use the FPGA's external memory interface (EMIF) and follow the guidelines provided in the Intel FPGA Memory Interface Handbook.
  • Yes, the 10AX027E4F29I3SG supports high-speed serial interfaces like PCIe and SATA, and you can use the FPGA's transceivers to implement these interfaces.
  • To optimize timing closure for your design on the 10AX027E4F29I3SG, you should use the Intel Quartus Prime software to analyze and optimize the timing of your design, and also consider using techniques like pipelining and retiming.
  • Yes, the 10AX027E4F29I3SG has built-in cryptographic primitives and can be used for cryptographic applications, but you need to ensure that your design meets the relevant security standards and regulations.

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10AX027E4F29I3SG Overview

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