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10AX027H3F34I2SG - Intel

Description: FPGA Arria® 10 GX Family 270000 Cells 20nm Technology 0.9V 1152-Pin FC-FBGA

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PCB Footprints
10AX027H3F34I2SG - Intel PCB footprint - BGA - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX027H3F34I2SG - Intel  - 3D model - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX027H3F34I2SG Details

  • Manufacturer Part Number:

    10AX027H3F34I2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    10162

  • Number of Inputs:

    384

  • Number of Logic Cells:

    270000

  • Number of Outputs:

    384

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10162 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AX027H3F34I2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX027H3F34I2SG FPGA is approximately 2.5W, but this can vary depending on the specific design and usage.
  • To implement a CDC in the 10AX027H3F34I2SG FPGA, you can use Intel's recommended CDC techniques, such as using asynchronous FIFOs or synchronizers, and follow the guidelines provided in the Intel FPGA Clock Domain Crossing User Guide.
  • The maximum frequency achievable with the 10AX027H3F34I2SG FPGA depends on the specific design and implementation, but Intel recommends a maximum clock frequency of 300 MHz for most applications.
  • To optimize your design for power consumption in the 10AX027H3F34I2SG FPGA, use Intel's PowerPlay power analysis and optimization tool, and follow best practices such as using clock gating, reducing switching activity, and optimizing voltage and frequency.
  • To implement a DDR3 memory interface in the 10AX027H3F34I2SG FPGA, use Intel's UniPHY IP core, which provides a pre-verified and optimized DDR3 interface solution, and follow the guidelines provided in the Intel FPGA DDR3 SDRAM Interface User Guide.

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10AX027H3F34I2SG Overview

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