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10AX027H4F34I3SG - Intel

Description: FPGA - Field Programmable Gate Array Arria 10 GX 270 FPGA

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PCB Footprints
10AX027H4F34I3SG - Intel PCB footprint - BGA - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35-1
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3D Models
10AX027H4F34I3SG - Intel  - 3D model - BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35-1
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10AX027H4F34I3SG Details

  • Manufacturer Part Number:

    10AX027H4F34I3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    10162

  • Number of Inputs:

    384

  • Number of Logic Cells:

    270000

  • Number of Outputs:

    384

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10162 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AX027H4F34I3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX027H4F34I3SG FPGA is approximately 2.5W, depending on the operating frequency and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and performance, use the Intel Quartus Prime software to analyze and optimize your design. This includes using the Design Space Explorer (DSE) to explore different design implementations, and the Performance Analyzer to identify performance bottlenecks.
  • To ensure signal integrity in your high-speed design, use the Intel Quartus Prime software to analyze and optimize your design for signal integrity. This includes using the Signal Integrity Tool to analyze signal integrity issues, and the Board Trace Modeler to model and analyze board-level signal integrity.
  • Intel recommends following the PCB design guidelines outlined in the Intel FPGA PCB Design Guidelines document, which includes guidelines for PCB layout, signal routing, and power distribution.

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