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10AX048H4F34E3SG - Intel

Description: FPGA - Field Programmable Gate Array Arria 10 GX 480 FPGA

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10AX048H4F34E3SG - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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10AX048H4F34E3SG - Intel  - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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10AX048H4F34E3SG Details

  • Manufacturer Part Number:

    10AX048H4F34E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    18359

  • Number of Inputs:

    492

  • Number of Logic Cells:

    480000

  • Number of Outputs:

    492

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Organization:

    18359 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AX048H4F34E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX048H4F34E3SG FPGA is approximately 12W, depending on the operating frequency and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow the clocking guidelines outlined in the Intel FPGA Clocking and PLL User Guide.
  • To optimize your design for area and performance, use the Intel Quartus Prime software to analyze and optimize your design. Utilize the software's built-in optimization tools, such as the Design Space Explorer (DSE) and the Hyper-Aptimize feature, to explore different design implementations and find the optimal solution.
  • To ensure signal integrity in your high-speed design, follow Intel's signal integrity guidelines, which include using differential signaling, minimizing trace lengths, and using termination resistors. Additionally, use the Intel Quartus Prime software to analyze and optimize your design for signal integrity.
  • Intel recommends a 4-layer or 6-layer PCB stack-up with a minimum of two power planes and two ground planes. The PCB layout should also follow Intel's guidelines for signal routing, decoupling, and thermal management.

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