- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 10AX066K4F35E3SG
- Part Number 10AX066K4F35E3SG
- Manufacturer Intel
- Pin Count 1152
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
- Released Date Aug 17, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
10AX066K4F35E3SG Details
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Manufacturer Part Number:
10AX066K4F35E3SG
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Package Description:
FBGA-1152
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Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
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ECCN Code:
3A991
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HTS Code:
8542.39.00.01
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Manufacturer:
Intel Corporation
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YTEOL:
9.15
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JESD-30 Code:
S-PBGA-B1152
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Length:
35 mm
10AX066K4F35E3SG Frequently Asked Questions (FAQs)
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The maximum power consumption of the 10AX066K4F35E3SG is approximately 12W, but this can vary depending on the specific design and usage.
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Intel provides a DDR3 memory interface IP core that can be used to implement a DDR3 memory interface on the 10AX066K4F35E3SG. The IP core is available through the Intel Quartus Prime software.
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Yes, the 10AX066K4F35E3SG has high-speed transceivers that can be used to implement PCIe and SATA interfaces. Intel provides IP cores and design examples to help with the implementation.
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To optimize the 10AX066K4F35E3SG for low power consumption, use the Intel Quartus Prime software to enable power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use low-power design techniques like pipelining and parallel processing.
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Yes, the 10AX066K4F35E3SG has built-in cryptographic primitives like AES and SHA that can be used to implement cryptographic algorithms. Intel also provides IP cores and design examples for cryptographic applications.
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10AX066K4F35E3SG Overview
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