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10AX066N3F40E2SG - Intel

Description: IC FPGA 588 I/O 1517FCBGA

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PCB Footprints
10AX066N3F40E2SG - Intel PCB footprint - BGA - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX066N3F40E2SG - Intel  - 3D model - BGA - 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip- Flat Top Single-Piece Lid - A:3.35
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10AX066N3F40E2SG Details

  • Manufacturer Part Number:

    10AX066N3F40E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1517

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • Length:

    40 mm

  • Number of CLBs:

    25168

  • Number of Inputs:

    588

  • Number of Logic Cells:

    660000

  • Number of Outputs:

    588

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Organization:

    25168 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

10AX066N3F40E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX066N3F40E2SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager, such as the Intel FPGA Clocking Wizard, to ensure reliable clock distribution and minimize skew.
  • To optimize power consumption, use Intel's Power Analyzer tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • To ensure signal integrity, use Intel's Signal Integrity Tool to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential pairs and minimizing trace length.
  • The maximum operating temperature of the 10AX066N3F40E2SG FPGA is 100°C, but it is recommended to operate the device at a temperature below 85°C for optimal performance and reliability.

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10AX066N3F40E2SG Overview

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