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10AX115H3F34E2SG - Intel

Description: IC FPGA 504 I/O 1152FCBGA

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PCB Footprints
10AX115H3F34E2SG - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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3D Models
10AX115H3F34E2SG - Intel  - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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10AX115H3F34E2SG Details

  • Manufacturer Part Number:

    10AX115H3F34E2SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • Additional Feature:

    ALSO OPERATES AT 0.95V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of CLBs:

    42720

  • Number of Inputs:

    504

  • Number of Logic Cells:

    1150000

  • Number of Outputs:

    504

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Organization:

    42720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

10AX115H3F34E2SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX115H3F34E2SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager, such as the Intel FPGA Clock Manager, to ensure reliable clock distribution and minimize clock skew.
  • To optimize power consumption, use Intel's Power Analyzer tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • To ensure signal integrity, use Intel's Signal Integrity Tool to analyze and optimize signal routing, and implement techniques such as differential signaling, shielding, and termination to minimize signal degradation.
  • The recommended design flow is to use Intel's Quartus Prime software to design, synthesize, and implement your design, and then use the Intel FPGA SDK for SoC to develop and debug your software.

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10AX115H3F34E2SG Overview

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